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Generative Design Optimizes Liquid-Cooling Channels For 2.5D And 3D Packages (UM-Dearborn)
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关键摘要
Researchers from University of Michigan-Dearborn published a technical paper titled “Generative Design of Liquid-Cooling Channels for Thermal Management of 2.…
- 5D and 3D Integrated Advanced Packaging.
- ” Abstract Excerpt: The paper presents “a physics-guided generative de…
- 7 kW multi-chip package containing two high power GPUs and one CPU.
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正文提要
Researchers from University of Michigan-Dearborn published a technical paper titled “Generative Design of Liquid-Cooling Channels for Thermal Management of 2.5D and 3D Integrated Advanced Packaging.”
Abstract Excerpt: The paper presents “a physics-guided generative design framework for liquid cooling channel topology optimization” in a “2.7 kW multi-chip package containing two high power GPUs and one CPU.” It also reports that G1016 reduced “the maximum GPU temperature, the temperature spread, and the pressure drop by 33.6%, 52.5%, and 72.8%, respectively.”
Find the technical paper here. August 2026.
Acquah, Michael, and Zheng Liu. “Generative Design of Liquid-Cooling Channels for Thermal Management of 2.5D and 3D Integrated Advanced Packaging.” arXiv, August 2026. https://doi.org/10.48550/arXiv.2608.22787.
The post Generative Design Optimizes Liquid-Cooling Channels For 2.5D And 3D Packages (UM-Dearborn) appeared first on Semiconductor Engineering.