Researchers from University of Michigan-Dearborn published a technical paper titled “Generative Design of Liquid-Cooling Channels for Thermal Management of 2.5D and 3D Integrated Advanced Packaging.”

Abstract Excerpt: The paper presents “a physics-guided generative design framework for liquid cooling channel topology optimization” in a “2.7 kW multi-chip package containing two high power GPUs and one CPU.” It also reports that G1016 reduced “the maximum GPU temperature, the temperature spread, and the pressure drop by 33.6%, 52.5%, and 72.8%, respectively.”

Find the technical paper here. August 2026.

Acquah, Michael, and Zheng Liu. “Generative Design of Liquid-Cooling Channels for Thermal Management of 2.5D and 3D Integrated Advanced Packaging.” arXiv, August 2026. https://doi.org/10.48550/arXiv.2608.22787.

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