微信内可能无法直接打开本站。请点右上角 ··· → 在浏览器打开，或复制链接。
Open-Source Benchmark Suite For 2.5D/3D Heterogeneous Integration Research in Physical Design (UCLA)
RSS 官方收录 · 可信分层展示
关键摘要
Researchers from University of California, Los Angeles published a technical paper titled “An Open-Source Benchmark Suite of 3D-IC Testcases.…
- ” Abstract Excerpt: The paper presents an “open-source suite of 3D-IC …
- ” Find the technical paper here.
- August 2026.
摘要引擎：抽取
正文提要
Researchers from University of California, Los Angeles published a technical paper titled “An Open-Source Benchmark Suite of 3D-IC Testcases.”
Abstract Excerpt: The paper presents an “open-source suite of 3D-IC benchmark testcases” and provides “reusable virtual chiplet models covering compute, memory, I/O, analog, and substrate components.”
Find the technical paper here. August 2026.
Soni, Rohan, Jooyeon Jeong, Alexander Graening, Anthony Foo, Richard Chen, and Puneet Gupta. “An Open-Source Benchmark Suite of 3D-IC Testcases.” arXiv, August 2026. https://doi.org/10.48550/arXiv.2608.25155.
The post Open-Source Benchmark Suite For 2.5D/3D Heterogeneous Integration Research in Physical Design (UCLA) appeared first on Semiconductor Engineering.