Researchers from University of California, Los Angeles published a technical paper titled “An Open-Source Benchmark Suite of 3D-IC Testcases.”

Abstract Excerpt: The paper presents an “open-source suite of 3D-IC benchmark testcases” and provides “reusable virtual chiplet models covering compute, memory, I/O, analog, and substrate components.”

Find the technical paper here. August 2026.

Soni, Rohan, Jooyeon Jeong, Alexander Graening, Anthony Foo, Richard Chen, and Puneet Gupta. “An Open-Source Benchmark Suite of 3D-IC Testcases.” arXiv, August 2026. https://doi.org/10.48550/arXiv.2608.25155.

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