The current state of Hybrid Bonding in 2026 — TSMC sits at 6 microns and the HBM delay that nobody expected
Hybrid bonding, the copper-to-copper joining technique that replaces solder microbumps in 3D chip stacks, is in high-volume production on logic chips and has just been postponed for use with memory.…
TSMC has scaled its SoIC bond pitch from 9 microns to 6 and laid out a…
5 by 2029; Intel began shipping Foveros Direct hybrid bonding in its C…
However, a JEDEC decision earlier this year to raise the HBM stack-hei…
Toyohiro Akiyama, first Japanese citizen and journalist in space, dies at 84
The first Japanese citizen to launch into space, Toyohiro Akiyama was also the first commercially sponsored cosmonaut and the world's first journalist to file reports while on a spaceflight.…
Akiyama, 84, died last Wednesday, August 26, of lower gastrointestinal…
A funeral was held with his close relatives in attendance.
As a correspondent for the Tokyo Broadcasting System (TBS), Akiyama wa…
The Army just used a 20-kilowatt laser to take out three drones
This week, the US Army used a high-energy multipurpose laser to shoot down three drones near the US-Mexico border, which official reports claimed were “posing a physical threat to US military personnel and CBP partners,” referring to Customs and Border Patrol.…
The operation took place between the night of August 25 and the early …
Authorities confirmed that, during the operation, agents used technolo…
Available information suggests that this initiative began in September…