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Aggregate Tom's Hardware 芯片半导体 45″

Hardware modder builds overclocked PS3 ‘Pro’ v3 with 3D-printed cooling mod — dual Noctua fans and server heatsinks provide FPS boost in 'almost every game'

A Sony PlayStation 3 console modder has shared images and details of their ‘PS3 Pro v3’ design.…

  • On the PS3 subreddit, Fun-Equivalent-7785 showcases this project, whic…
  • While you may love or hate the new aesthetic, the results seem impress…
  • My ps3 pro v3 RSX 750/1000 512gb ssd, 2tb iso hdd, ps5 pad plus wingma…

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Aggregate Tom's Hardware 芯片半导体 45″

Atari revives 39 Activision games on cartridges that run seamlessly across five decades of hardware — Ultimate Deluxe collection that includes every title costs a wild $999.96

Atari has officially unveiled the Atari x Activision Collection, a compilation featuring 39 classic Activision games on physical cartridges.…

  • An individual cartridge starts at $34.
  • 98, while the Ultimate Deluxe Set, which includes all 39 games, costs …
  • Atari and Activision's latest collaboration brings the nostalgia and v…

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Aggregate Tom's Hardware 芯片半导体 45″

Polls reveal local utility hikes and noise drive US data center protests, not anti-AI sentiment— beliefs and political affiliation had minimal impact on AI data center views

Data centers are unpopular among U.S.citizens right now, with projects facing resistance and moratoriums across the nation.…

  • While we’ve seen over a hundred protests against the developments happ…
  • Is it big tech?
  • AI skepticism?

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Aggregate Tom's Hardware 芯片半导体 45″

Nvidia revenue tops $96 billion as memory commitments soar to $160 billion — CEO Jensen Huang says AI 'has reached its inflection point'

It has become a tradition that every single quarter Nvidia reports record results that outpace all of its quarterly results before that.…

  • This Wednesday was no exception as the company posted revenue of $96.
  • 2 billion, which was up 106% year-over-year, due to rising demand for …
  • But such results come at a cost, as the company has to invest massivel…

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Aggregate Semiconductor Engineering 芯片半导体 45″

Full-Fidelity Thermal Simulation at Floorplanning Speed for 2.5D AI Accelerator Packages

Power densities in modern AI accelerators and HPC devices now routinely exceed 1 W/mm².At the same time, 2.…

  • 5D packages co-integrate high-power accelerator ASICs (e.
  • , NVIDIA, AMD) with 8–16 High Bandwidth Memory (HBM) stacks (e.
  • , Micron, Samsung, SK Hynix), pushing system-level thermal behavior to…

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Aggregate Semiconductor Engineering 芯片半导体 45″

From GAA To CFET: Scaling Transistors For The AI Era

By Urmimala Roy, Xi-Wei Lin, and Ravi Todi Two years ago, we introduced why the industry was moving to gate‑all‑around (GAA) transistors and why Foundation IP co-optimized with electronic design automation (EDA) flows would be key to success to making that transition work.…

  • Since then, GAA has moved from early adoption into the mainstream of l…
  • As designs push past the 2nm node, the architectures that carried CMOS…
  • Each new node must deliver better power, performance, and area (PPA) w…

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Aggregate Semiconductor Engineering 芯片半导体 45″

Streamlining 3D-IC Design: Substrate, Finalization, And Tapeout

By Keith Felton and Todd Burkholder The superior performance, functionality, and smaller form factors of 3D-ICs are propelling advances in the semiconductor industry.…

  • Unlike traditional 2D-ICs, 3D-ICs vertically stack multiple active dev…
  • This vertical integration delivers many benefits but introduces furthe…
  • In the first two articles in this series (published in this journal in…

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Aggregate Semiconductor Engineering 芯片半导体 45″

How Agentic AI Turns IC Engineers Into Architects

Software engineering has already undergone a strange transition: everyone is coding, but increasingly, nobody is typing.…

  • AI coding tools have evolved from autocomplete into agents that take a…
  • Chip design is next; but the transition will be slower, harder, and po…
  • As the semiconductor industry adopts AI-native chip design workflows, …

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Aggregate Semiconductor Engineering 芯片半导体 45″

Verified. Until It Isn’t: Why Datapath Verification Needs A New Playbook

By Ashish Darbari, Nicky Khodadad, and Nguyen Vu The semiconductor industry continues to debate DPV versus FPV, but the real challenge is achieving scalable, trustworthy verification for AI-era silicon.…

  • Modern RISC-V, Arm, x86, GPU and AI accelerators rely on increasingly …
  • The methodology argument has become a distraction from a much harder q…
  • Why datapath verification matters From the Intel FDIV incident to toda…

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Aggregate Semiconductor Engineering 芯片半导体 45″

How Cache Coherency Simplifies AI Software

There was a time when adding hardware simply to make software more efficient was considered wasteful.…

  • Every additional hardware feature consumed valuable area, increased po…
  • With transistor budgets tightly constrained, hardware was reserved for…
  • This tradeoff is changing.

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Aggregate Semiconductor Engineering 芯片半导体 45″

Planning Your AI Design Journey: Start With What You’d Lose

If your three most-senior RF engineers retire next week, how much of your design capability would walk out the door with them?…

  • The honest answer would make most engineering leaders squirm.
  • Today, RF and microwave design still depends heavily on institutional …
  • Without that knowledge, onboarding is measured in months instead of af…

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Aggregate Semiconductor Engineering 芯片半导体 45″

Agentic AI Success Relies On Excellent Human Scaffolding

Key Takeaways: Long-running autonomous multi-agent systems have progressed significantly in the last year, but gaps remain in the full design flow.…

  • Companies and customers are starting to see positive ROI, with agents …
  • To conserve resources, human engineers need to define the ontology (st…
  • Experts At The Table: Semiconductor Engineering sat down to discuss re…

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Aggregate Semiconductor Engineering 芯片半导体 45″

From Spec To Formal Properties

Key Takeaways: Turning a specification into a set of properties is something that LLMs as capable of doing.…

  • However, most specifications are inadequate, AI tools are immature, an…
  • There are hidden dangers in blindly accepting the output of AI tools.
  • Other methods must be used to assess completeness.

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Aggregate Semiconductor Engineering 芯片半导体 45″

Issues Stack Up With More HBM Layers

Key Takeaways: HBM scaling is running into physical limitations.More bandwidth translates into higher area and capacity costs.…

  • AI demand is intensifying the DRAM shortage.
  • DRAM is under stress, and the fallout is affecting the entire chip ind…
  • Pressed by large systems companies to move data in and out of memory f…

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Aggregate EE Times 芯片半导体 17″

Why Connectivity Has Become an Edge AI Design Decision

In real-world edge AI systems, the AI model is only one part of the design.…

  • A device must also sense its environment, process information locally,…

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Aggregate Tom's Hardware 芯片半导体 45″

Nvidia custom 'NVHBM' promises 30% higher bandwidth, 15% lower power than commodity HBM4e — custom base die and PHY will be available to NVLink Fusion partners

Nvidia's NVLink Fusion program gives the company's partners the building blocks necessary to connect custom chips with the NVLink scale-up domain used to join many separate processors into a single coherent system like the Vera Rubin NVL72 rack-scale accelerator.…

  • Today, Nvidia is adding a new building block to that toolkit: NVHBM, a…
  • Go deeper with TH Premium: Memory(Image credit: SK Hynix)AI data cente…
  • Nvidia says it's designed and validated with "leading memory vendors,"…

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Aggregate EE Times 芯片半导体 17″

NVMe 2.4 Update Adds Post-Quantum Security, Power Controls

As the non-volatile memory express (NVMe) protocol moves to an annual release cycle, the latest updates reflect the growing maturity of the ecosystem and the rapid pace of innovation driving its

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Aggregate IEEE Spectrum 芯片半导体 45″

IEEE Student Conference Provides Visibility to Budding Authors

The IEEE–Eta Kappa Nu (IEEE-HKN) honor society is preparing to host the Innovating the Future event on 6 November.…

  • The inaugural one-day, in-person event is designed to provide a forum …
  • A keynote address and thematic presentation sessions are planned as we…
  • Student attendees can network with their peers and gain firsthand expe…

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Aggregate Tom's Hardware 芯片半导体 45″

US Justice Department seizes domains it says Chinese state-sponsored hackers used to infiltrate systems at NASA, Senate, Federal Reserve, and more — FBI moves forward with domain seizures

The U.S.…

  • Department of Justice and FBI revealed in a statement Wednesday that i…
  • The press release says the Federal Reserve, Department of Energy, Depa…
  • Senate all experienced "computer intrusion activity.

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Aggregate Tom's Hardware 芯片半导体 45″

Hot Chips 2026: Nvidia presents Groq 3 LPX architecture and unveils its first third-party inference benchmark — LP30-based rack already in production, company says

This Tom's Hardware Premium article is free to read with a Tom's Hardware account; no payment necessary.…

  • We're offering free access from August 23 to 26 so you can read all of…
  • Groq's former chief architect stood on stage at Hot Chips 2026 and pre…
  • Igor Arsovski, now Nvidia's VP of hardware, presented the Groq 3 LPX r…

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Aggregate Tom's Hardware 芯片半导体 45″

Kansas town drops charges against teacher who clapped during public hearings on data centers — says that ‘case has been dismissed without prejudice’

Lux Claridge, the teacher who was arrested in Emporia, Kansas, during an AI data center meeting for clapping, said that the city has dropped the charges against them.…

  • According to 404 Media, the Emporia assistant city attorney told Clari…
  • Unfortunately, that doesn’t mean that they’re in the clear yet, as the…
  • Go deeper with TH Premium: AI and data centers(Image credit: Microsoft…

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Aggregate Tom's Hardware 芯片半导体 45″

Xbox announces new disc-to-digital feature for physical media — lets players claim digital versions of their games, with support for Play Anywhere and Cloud Gaming

Xbox has unveiled its long-rumored new disc-to-digital service, which will let players who own physical copies of games claim digital entitlements, playing them as if they own digital copies.…

  • In an announcement, Microsoft confirmed support will include digital b…
  • "Players have spent decades building their XBOX libraries.
  • Some games were purchased on disc.

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Aggregate Tom's Hardware 芯片半导体 45″

Hot Chips 2026: Nvidia touts benefits of its DSX MaxLPS site power management approach — tech allows for more compute from fixed data center power budgets

This Tom's Hardware Premium article is free to read with a Tom's Hardware account; no payment necessary.…

  • We're offering free access from August 23 to 26 so you can read all of…
  • For as much as we might discuss the performance of an individual CPU, …
  • The management and allocation of that power is a major concern for max…

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Aggregate Tom's Hardware 芯片半导体 45″

Save $260 on this high-end AM5 gaming combo from Newegg — just $1,345.99 buys a Ryzen 9 9950X3D, 32GB Corsair DDR5 RAM, MSI X870E Carbon Wifi motherboard, along with a free 240mm AIO and AMD game bund

Newegg has come out with a new high-end AM5 bundle that pairs the venerable Ryzen 9 9950X3D processor, 32GB (2x16GB) Corsair Vengeance DDR5-6000 RAM, and a premium motherboard in MSI’s MPG X870E Carbon Wifi for only $1,345.…

  • You save $260 (16%), which, when you apply that beefy combo discount t…
  • Check out all the RAM combo deals on NeweggThe RAM portion of the bund…
  • 99 when bought separately.

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