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Chip Industry Technical Paper Roundup: Aug. 18
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关键摘要
New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations ReVolt: Power Delivery Network-Aware Voltage Droop Control for 2.…
- 5D PIM Chiplet Architectures Washington State University, University o…
- imec From Lithography to Nanoimprint: Physics-Based, Data-Driven, and …
- 5D Systems A*STAR Self-Focusing Control for Depth-Precise Wafer Slicin…
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正文提要
New technical papers recently added to Semiconductor Engineering’s library:
| Technical Paper | Research Organizations |
|---|---|
| ReVolt: Power Delivery Network-Aware Voltage Droop Control for 2.5D PIM Chiplet Architectures | Washington State University, University of Wisconsin–Madison |
| SCALE: Self-Supervised Constraint-Aware Layout GEneration for Local P&R DRV Fixing at Advanced Nodes | NVIDIA, Duke University |
| Are Gate-All-Around 2D CFETs the Optimal Architecture for the A2 Node and Beyond? | imec |
| From Lithography to Nanoimprint: Physics-Based, Data-Driven, and Hybrid Frameworks for Defect Prediction in Advanced Patterning Technologies | National Taiwan University |
| Innovative FA Hardware Solution to Enable System-Level Debug of 3D ICs | Google, Delft University of Technology |
| FAPlace: Joint Optimization of Chiplet Placement and Interposer Footprint for 2.5D Systems | A*STAR |
| Self-Focusing Control for Depth-Precise Wafer Slicing of 4H-SiC in Femtosecond Laser Processing | Texas A&M University, KIMM, UST |
Find more semiconductor research papers here.
The post Chip Industry Technical Paper Roundup: Aug. 18 appeared first on Semiconductor Engineering.