{"node":{"id":13408,"uuid":"1dcf77bc-8195-451c-926e-944460c20ac2","title":"Streamlining 3D-IC Design: Substrate, Finalization, And Tapeout","url":"https:\/\/xmt.pub\/index.php\/node\/13408","created":1787819471},"trust_level":"l0_aggregate","publisher":null,"source_url":"https:\/\/semiengineering.com\/streamlining-3d-ic-design-substrate-finalization-and-tapeout\/","provenance":{"algorithm":"sha256(source_url|publisher_id|created)","stored":"f52a046dec2ce8ecaf60775d38c8522fb7ee6cf17923cf1f917aa5dd24c0d4e9","expected":"f52a046dec2ce8ecaf60775d38c8522fb7ee6cf17923cf1f917aa5dd24c0d4e9","status":"verified"}}